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1. (WO2018101471) ELECTROCONDUCTIVE BONDING MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/101471    International Application No.:    PCT/JP2017/043350
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Sat Dec 02 00:59:59 CET 2017
IPC: H01B 1/22
B22F 1/00
B22F 7/08
H01B 1/00
H01L 21/52
Applicants: TANAKA KIKINZOKU KOGYO K.K.
田中貴金属工業株式会社
Inventors: FURUSHO Rikia
古正 力亜
ABE Shintaro
阿部 真太郎
KONDO Takeshi
近藤 剛史
TANAKA Teruki
田中 輝樹
Title: ELECTROCONDUCTIVE BONDING MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
The present invention provides an electroconductive bonding material with which it is possible to form a bonding layer having an extremely low void ratio at a low application of pressure, and which has high bonding strength and heat conductivity. The present invention pertains to an electroconductive bonding material for bonding a chip and an adherend under pressure, the electroconductive bonding material including silver particles, silver compound particles, and a dispersing agent, wherein the weight ratio of the silver particles and the silver compound particles is from 30:70 to 70:30, and the void ratio of the electroconductive bonding material is 15% or less after the chip and the adherend are compressed and bonded for five minutes at 10 MPa and 280°C under atmosphere.