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|1. (WO2018101453) TEMPORARY ADHESIVE AND COMPONENT MANUFACTURING METHOD|
|Applicants:||DNP FINE CHEMICALS CO., LTD.
|Title:||TEMPORARY ADHESIVE AND COMPONENT MANUFACTURING METHOD|
The present invention provides a temporary adhesive that is capable of satisfactorily temporarily bonding, to a machining substrate, various component precursors subject to machining, and provides a wafer manufacturing method comprising a polishing step enabling high-precision polishing of a surface of a wafer to be polished. The temporary adhesive contains rosin, a shellac, a lower alcohol constituted by an alcohol comprising five or fewer carbon atoms, and a polyhydric alcohol derivative constituted by an alcohol derivative having a molecule comprising two or more hydroxyl groups. The component manufacturing method comprises: a temporary bonding step in which the temporary adhesive is used to form an adhesive coating between a component precursor and a machining substrate, and the component precursor is temporarily bonded to the machining substrate; and a machining step in which a surface to be machined of the component precursor temporarily bonded to the machining substrate in the temporary bonding step is machined.