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1. (WO2018101453) TEMPORARY ADHESIVE AND COMPONENT MANUFACTURING METHOD

Pub. No.:    WO/2018/101453    International Application No.:    PCT/JP2017/043216
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Fri Dec 01 00:59:59 CET 2017
IPC: C09J 193/04
C09J 193/02
H01L 21/304
Applicants: DNP FINE CHEMICALS CO., LTD.
株式会社DNPファインケミカル
Inventors: FUKUCHI Masaru
福地 勝
YOSHINO Masashi
吉野 政志
ODAGIRI Kunihiko
小田切 邦彦
IWASAKI Akira
岩崎 章
Title: TEMPORARY ADHESIVE AND COMPONENT MANUFACTURING METHOD
Abstract:
The present invention provides a temporary adhesive that is capable of satisfactorily temporarily bonding, to a machining substrate, various component precursors subject to machining, and provides a wafer manufacturing method comprising a polishing step enabling high-precision polishing of a surface of a wafer to be polished. The temporary adhesive contains rosin, a shellac, a lower alcohol constituted by an alcohol comprising five or fewer carbon atoms, and a polyhydric alcohol derivative constituted by an alcohol derivative having a molecule comprising two or more hydroxyl groups. The component manufacturing method comprises: a temporary bonding step in which the temporary adhesive is used to form an adhesive coating between a component precursor and a machining substrate, and the component precursor is temporarily bonded to the machining substrate; and a machining step in which a surface to be machined of the component precursor temporarily bonded to the machining substrate in the temporary bonding step is machined.