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|1. (WO2018101444) MAGNETRON SPUTTERING DEVICE AND MAGNETIC FIELD FORMING DEVICE|
|Applicants:||NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
|Title:||MAGNETRON SPUTTERING DEVICE AND MAGNETIC FIELD FORMING DEVICE|
Through the present invention, the structure of a magnetron sputtering device is simplified. The magnetron sputtering device according to the present invention is provided with a vacuum chamber, a sputtering target, an inner annular magnet, an outer annular magnet, and a yoke. The sputtering target is disposed in the vacuum chamber. The inner annular magnet is disposed on a back surface side of the sputtering target, and is provided with magnetic poles each having a different polarity in the vicinity of a central part and an outer edge part of the sputtering target, and thereby forms a loop-shaped magnetic flux intersecting with the central part and the outer edge part of the sputtering target and bulging toward the front surface side of the sputtering target. The outer annular magnet is disposed on the outside of the inner annular magnet on the back surface side of the sputtering target, and adjusts the loop-shaped magnetic flux in the vicinity of an outer edge of the sputtering target. The yoke retains the inner annular magnet and the outer annular magnet.