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1. (WO2018101405) CHIP-TYPE ELECTRONIC COMPONENT
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Pub. No.: WO/2018/101405 International Application No.: PCT/JP2017/043063
Publication Date: 07.06.2018 International Filing Date: 30.11.2017
IPC:
H01G 4/252 (2006.01) ,H01G 2/06 (2006.01) ,H01G 4/12 (2006.01) ,H01G 4/228 (2006.01) ,H01G 4/232 (2006.01) ,H01G 4/30 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
002
Details
228
Terminals
252
the terminals being coated on the capacitive element
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
2
Details of capacitors not covered by a single one of groups H01G4/-H01G11/112
02
Mountings
06
specially adapted for mounting on a printed-circuit support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
002
Details
018
Dielectrics
06
Solid dielectrics
08
Inorganic dielectrics
12
Ceramic dielectrics
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
002
Details
228
Terminals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
002
Details
228
Terminals
232
electrically connecting two or more layers of a stacked or rolled capacitor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
30
Stacked capacitors
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
藤田 幸宏 FUJITA, Yukihiro; JP
神部 昌吾 KANBE, Shogo; JP
中野 公介 NAKANO, Kosuke; JP
大塚 英樹 OTSUKA, Hideki; JP
Agent:
小柴 雅昭 KOSHIBA, Masaaki; JP
Priority Data:
2016-23371701.12.2016JP
Title (EN) CHIP-TYPE ELECTRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE DE TYPE PUCE
(JA) チップ型電子部品
Abstract:
(EN) Provided is a chip-type electronic component for which it is easy to place spacers having sufficient heat resistance in a desired position and orientation. On a mounting surface (6), spacers (16, 17) have a prescribed thickness direction dimension (T) measured in a direction perpendicular to the mounting surface (6), and, for example, there is a “squeal” suppression effect for a laminated ceramic capacitor, and it is also possible to have three-dimensional mounting. The spacers (16, 17) have as a main component an intermetallic compound that contains a high-melting-point metal of at least one type selected from Cu and Ni, and Sn as a low-melting-point metal.
(FR) L'invention concerne un composant électronique de type puce pour lequel il est facile de placer des espaceurs ayant une résistance thermique suffisante dans une position et une orientation souhaitées. Sur une surface de montage (6), des espaceurs (16, 17) ont une dimension de direction d'épaisseur prescrite (T) mesurée dans une direction perpendiculaire à la surface de montage (6), et, par exemple, il y a un effet de suppression de "crissement" pour un condensateur céramique stratifié, et il est également possible d'avoir un montage tridimensionnel. Les espaceurs (16, 17) ont en tant que composant principal un composé intermétallique qui contient un métal à point de fusion élevé d'au moins un type choisi parmi Cu et Ni, et Sn en tant que métal à bas point de fusion.
(JA) 所望の位置および向きに十分な耐熱性を有するスペーサを配置することが容易なチップ型電子部品を提供する。 スペーサ(16,17)は、実装面(6)上において、当該実装面(6)に対して垂直な方向に測定した所定の厚み方向寸法(T)を有していて、たとえば、積層セラミックコンデンサの「鳴き」抑制効果があり、3次元実装をも可能にする。スペーサ(16,17)は、CuおよびNiから選ばれる少なくとも1種の高融点金属と低融点金属としてのSnとを含む金属間化合物を主成分としている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)