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1. (WO2018101333) COMPOSITION FOR FORMING PROTECTIVE FILM FOR ELECTROCONDUCTIVE PATTERN, PROTECTIVE FILM FOR ELECTROCONDUCTIVE PATTERN, METHOD FOR PRODUCING PROTECTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT ELECTROCONDUCTIVE FILM

Pub. No.:    WO/2018/101333    International Application No.:    PCT/JP2017/042822
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Thu Nov 30 00:59:59 CET 2017
IPC: C09D 175/04
B05D 3/02
B05D 7/00
B05D 7/24
C09D 7/40
C09D 163/00
H01B 13/00
Applicants: SHOWA DENKO K.K.
昭和電工株式会社
Inventors: TOBA Masahiko
鳥羽 正彦
NAKAZAWA Eri
中澤 恵理
YAMAKI Shigeru
山木 繁
Title: COMPOSITION FOR FORMING PROTECTIVE FILM FOR ELECTROCONDUCTIVE PATTERN, PROTECTIVE FILM FOR ELECTROCONDUCTIVE PATTERN, METHOD FOR PRODUCING PROTECTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT ELECTROCONDUCTIVE FILM
Abstract:
[Problem] To provide: a composition for forming a protective film for electroconductive patterns for forming, in a short period of time and with low energy consumption, a protective film which has suitable optical properties, and which, while maintaining electrical contact properties to a transparent electroconductive film containing a silver nanowire, can impart high environmental resistance to the transparent electroconductive film; a protective film for electroconductive patterns; a method for producing a protective film; and a method for producing a transparent electroconductive film. [Solution] A composition for a protective film for electroconductive patterns, comprising: (A) a polyurethane containing a carboxyl group; (B) an epoxy compound; (C) a curing accelerator; and (D) a solvent, wherein the percentage of the solvent (D) contained is from 95.0% to 99.9% by mass, and the solvent (D) contains (D1) a solvent containing a hydroxyl group and having a boiling point in excess of 100°C, and (D2) a solvent having a boiling point that does not exceed 100°C, wherein the content of the solvent (D2) having a boiling point that does not exceed 100°C is 30% to less than 70% by mass as a percentage of total solvents. The composition can be cured by heating at a temperature not exceeding 100°C for a heating time not exceeding 10 minutes.