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1. (WO2018101171) MOLD CONNECTOR

Pub. No.:    WO/2018/101171    International Application No.:    PCT/JP2017/042257
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Sat Nov 25 00:59:59 CET 2017
IPC: H01R 13/405
H01R 13/56
Applicants: SUMITOMO WIRING SYSTEMS, LTD.
住友電装株式会社
Inventors: IZAWA, Katsutoshi
伊澤 克俊
Title: MOLD CONNECTOR
Abstract:
This mold connector is provided with, at a terminal part of an electric wire 1 in which wires 2 are covered with a coating material 3, a connector part 6 that is obtained by molding a synthetic resin so as to cover the coating material 3, wherein an exposure part 12 obtained by exposing the wires 2 by peeling the coating material 3 is provided at a position where the connector part 6 is to be molded, and the connector part 6 is molded so as to cover the exposure part 12 and the coating material 3 adjacent to the exposure part 12.