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|1. (WO2018101159) CONNECTION WIRING|
|Applicants:||SHARP KABUSHIKI KAISHA
Provided is connection wiring which suppresses faulty connections between pumps and pads when mounting semiconductor chips, and allows for an increase in the number of pads. In a region sandwiched by a pad row at a particular level and a pad row at a level adjacent to said level, the connection wiring is arranged such that a first wire 31 goes beneath a second wire 32 which is adjacent thereto, and the second wire 32 goes above the first wire 31 which is adjacent thereto. In this case, of the three wires, the wire located in the middle is the first wire 31, and the second wire 32 is disposed so as to sandwich the first wire 31, even in a region sandwiched by pads 20 at any level. The pitch of the pads 20 can thus be made narrower without reducing the width of the pads.