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1. (WO2018101138) CONNECTION STRUCTURE

Pub. No.:    WO/2018/101138    International Application No.:    PCT/JP2017/041948
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Thu Nov 23 00:59:59 CET 2017
IPC: H05K 3/32
C08L 101/00
H01B 5/16
H01R 11/01
Applicants: DEXERIALS CORPORATION
デクセリアルズ株式会社
Inventors: ARAKI, Yuta
荒木 雄太
Title: CONNECTION STRUCTURE
Abstract:
In a method for manufacturing this connection structure by connecting, in an anisotropically conductive manner using an anisotropic conductive film, a first electronic component 30A having a terminal pattern in which a plurality of terminals are parallelly disposed in a radial configuration and a second electronic component 30B having a terminal pattern corresponding to the terminal pattern 21A of the first electronic component 30A, (i) the effective connection area per terminal is set equal to or larger than least 3,000 μm2, the density of conductive particles 1 in an anisotropic film 10A is set to 2,000-20,000 particle/mm2, (ii) an anisotropic conductive film 10B is configured to have conductive particles arrayed in a square-lattice pattern in such an array pitch and array direction as to cause each terminal to trap at least three conductive particles, or (iii) an anisotropic conductive film C in use is one having a multi-circular region 25. The connection structure manufactured by this method can reduce or eliminate terminals in which conductive particles are not trapped.