Search International and National Patent Collections

1. (WO2018101090) DOUBLE-SIDED ADHESIVE SHEET AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/101090    International Application No.:    PCT/JP2017/041530
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Sat Nov 18 00:59:59 CET 2017
IPC: C09J 7/02
B32B 27/00
C09J 183/04
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: SAIKI Naoya
佐伯 尚哉
OGASAWARA Takafumi
小笠原 孝文
SAKAMOTO Misaki
坂本 美紗季
Title: DOUBLE-SIDED ADHESIVE SHEET AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Abstract:
A double-sided adhesive sheet 1 having, layered in the following order, a second release sheet 15, a second adhesive agent layer 13, a core material 11, a first adhesive agent layer 12, and a first release sheet 14, wherein the first adhesive agent layer 12 and the second adhesive agent layer 13 are formed of a silicone adhesive agent, a release strength P2 when releasing the second release sheet 15 is 30-1000 mN/50 mm, the ratio of an adhesive strength A1 of an adhesive surface of the first adhesive agent layer 12 with respect to the release strength P2 is 10-5000, an adhesive strength B1 of the adhesive surface of the first adhesive agent layer 12 after being heated at 260°C for one minute is 500-15000 mN/25 mm, and the difference in adhesive strength obtained by subtracting, from the adhesive strength B1, an adhesive strength B2 of an adhesive surface of the second adhesive agent layer 13 after being heated at 260°C for one minute, is 1000-20000 mN/25 mm. The double-sided adhesive sheet 1 can be used, without causing any problem, in a production method for a semiconductor device including a step accompanied by heating.