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1. (WO2018101078) SOLID-STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE

Pub. No.:    WO/2018/101078    International Application No.:    PCT/JP2017/041419
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Sat Nov 18 00:59:59 CET 2017
IPC: H01L 27/146
H01L 27/30
H01L 51/42
H04N 5/374
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
ソニーセミコンダクタソリューションズ株式会社
Inventors: JOEI Masahiro
定榮 正大
MURATA Kenichi
村田 賢一
Title: SOLID-STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
Abstract:
The present invention pertains to a solid-state imaging element that enables suppression of fluctuation in photoelectric conversion characteristics of an organic photoelectric conversion film caused by exposure to air, a method for manufacturing the solid-state imaging element, and an electronic device. This solid-state imaging element is provided with: a photoelectric conversion film that is formed on the upper side of a semiconductor substrate; and side walls that seal the side surfaces of the photoelectric conversion film. The side walls are formed of a film obtained through re-deposition of a film directly below. The present invention can be applied to, for example, a CMOS image sensor, etc.