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1. (WO2018101033) SENSOR CHIP AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/101033    International Application No.:    PCT/JP2017/041010
Publication Date: 07.06.2018 International Filing Date: 15.11.2017
IPC:
H01L 27/146 (2006.01), H01L 31/107 (2006.01)
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014 (JP)
Inventors: TANAKA Akira; (JP).
OTAKE Yusuke; (JP).
WAKANO Toshifumi; (JP)
Agent: NISHIKAWA Takashi; (JP).
INAMOTO Yoshio; (JP)
Priority Data:
2016-231585 29.11.2016 JP
Title (EN) SENSOR CHIP AND ELECTRONIC DEVICE
(FR) PUCE DE CAPTEUR ET DISPOSITIF ÉLECTRONIQUE
Abstract: front page image
(EN)An imaging device comprises a sensor substrate including a pixel array that includes at least a first pixel. The first pixel includes an avalanche photodiode including a light receiving region, a cathode, and an anode. The first pixel includes a wiring layer electrically connected to the cathode and arranged in the sensor substrate such that the wiring layer is in a path of incident light that exits the light receiving region.
(FR)La présente invention concerne un dispositif d'imagerie qui comprend un substrat de capteur comprenant un réseau de pixels qui comprend au moins un premier pixel. Le premier pixel comporte une photodiode à avalanche comprenant une région de réception de lumière, une cathode et une anode. Le premier pixel comprend une couche de câblage électriquement connectée à la cathode et disposée dans le substrat de capteur de telle sorte que la couche de câblage se trouve sur un trajet de lumière incidente qui sort de la région de réception de lumière.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)