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1. (WO2018101033) SENSOR CHIP AND ELECTRONIC DEVICE

Pub. No.:    WO/2018/101033    International Application No.:    PCT/JP2017/041010
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Thu Nov 16 00:59:59 CET 2017
IPC: H01L 27/146
H01L 31/107
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventors: TANAKA Akira
OTAKE Yusuke
WAKANO Toshifumi
Title: SENSOR CHIP AND ELECTRONIC DEVICE
Abstract:
An imaging device comprises a sensor substrate including a pixel array that includes at least a first pixel. The first pixel includes an avalanche photodiode including a light receiving region, a cathode, and an anode. The first pixel includes a wiring layer electrically connected to the cathode and arranged in the sensor substrate such that the wiring layer is in a path of incident light that exits the light receiving region.