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1. (WO2018101024) BONDING DEVICE

Pub. No.:    WO/2018/101024    International Application No.:    PCT/JP2017/040883
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Wed Nov 15 00:59:59 CET 2017
IPC: H01L 21/683
H01L 21/02
Applicants: TAZMO CO., LTD.
タツモ株式会社
Inventors: TANABE Masaaki
田邉 雅明
Title: BONDING DEVICE
Abstract:
This bonding device is provided with: a first chuck part 1A; a second chuck part 1B; a first base part 21A; a second base part 21B; and a first floating mechanism 3A. The first chuck part 1A and the second chuck part 1B are a pair of chuck parts which are each provided with a suction surface for applying suction to objects to be bonded, and which are disposed such that the suction surfaces 11a, 11b face each other. The first base part 21A and the second base part 21B respectively support the first chuck part 1A and the second chuck part 1B. The first floating mechanism 3A causes the first chuck part 1A to float from the first base part 21A by applying air pressure to a rear surface 12a of the first chuck part 1A, and, as a result, the suction surface 11a of the first chuck part 1A is moved towards the suction surface 11b of the second chuck part 1B.