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1. (WO2018100933) THERMOELECTRIC MODULE
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Pub. No.: WO/2018/100933 International Application No.: PCT/JP2017/038733
Publication Date: 07.06.2018 International Filing Date: 26.10.2017
IPC:
H01L 35/30 (2006.01) ,H01L 35/32 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
30
characterised by the heat-exchanging means at the junction
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
32
characterised by the structure or configuration of the cell or thermo-couple forming the device
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
古川 智弘 FURUKAWA,Tomohiro; JP
Priority Data:
2016-23146529.11.2016JP
Title (EN) THERMOELECTRIC MODULE
(FR) MODULE THERMOÉLECTRIQUE
(JA) 熱電モジュール
Abstract:
(EN) A thermoelectric module of the present disclosure is provided with: a pair of insulating substrates 11, 21 having rectangular opposing regions facing opposite each other; wiring conductors 41, 42 respectively provided on one main surface facing opposite the pair of insulating substrates 11, 21; a pair of metal plates 12, 22 provided respectively on the other main surface on the reverse side to the one main surface of the pair of insulating substrates 11, 21; and a plurality of thermoelectric elements 3 placed between the one main surfaces of the pair of insulating substrates 11, 21. At least one insulating substrate 21 and metal plate 22 among the pair of insulating substrates 11, 21 and the pair of metal plates 12, 22 have a projection 20 that projects from one side of the opposite facing regions in plan view, and have a metal pattern 5 on one main surface of the projection 20 that is not electrically connected to the wiring conductor 42.
(FR) La présente invention concerne un module thermoélectrique qui est pourvu : d'une paire de substrats isolants (11, 21) ayant des régions opposées rectangulaires se faisant face ; de conducteurs de câblage (41, 42) disposés respectivement sur une surface principale faisant face à la paire de substrats isolants (11, 21) ; d'une paire de plaques métalliques (12, 22) disposées respectivement sur l'autre surface principale sur le côté opposé à la surface principale de la paire de substrats isolants (11, 21) ; d'une pluralité d'éléments thermoélectriques (3) placés entre les surfaces principales de la paire de substrats isolants (11, 21). Au moins un substrat isolant (21) et une plaque métallique (22) de la paire de substrats isolants (11, 21) et de la paire de plaques métalliques (12, 22) ont une saillie (20) qui fait saillie sur un côté des régions se faisant face dans une vue en plan, et présentent un motif métallique (5) sur une surface principale de la saillie (20) qui n'est pas électriquement connectée au conducteur de câblage (42).
(JA) 本開示の熱電モジュールは、互いに対向する矩形状の対向領域を有する一対の絶縁基板11,21と、一対の絶縁基板11,21の対向する一方主面にそれぞれ設けられた配線導体41,42と、一対の絶縁基板11,21の一方主面とは反対側の他方主面にそれぞれ設けられた一対の金属板12,22と、一対の絶縁基板11,21の一方主面間に配置された複数の熱電素子3とを備え、一対の絶縁基板11,21および一対の金属板12,22のうちの少なくとも一方の絶縁基板21および金属板22は、平面視で対向領域の一辺から突出する突出部20を有しているとともに、突出部20の一方主面に配線導体42とは電気的に接続されていない金属パターン5を有している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)