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1. (WO2018100922) MULTILAYER WIRING SUBSTRATE

Pub. No.:    WO/2018/100922    International Application No.:    PCT/JP2017/038178
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Tue Oct 24 01:59:59 CEST 2017
IPC: H05K 3/46
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: ARAKI, Shinichi
荒木 伸一
TAGUCHI, Hideyuki
田口 秀幸
NOMA, Hayato
野間 隼史
TAKADA, Ryosuke
▲高▼田 亮介
Title: MULTILAYER WIRING SUBSTRATE
Abstract:
Provided is a highly reliable, flat-plate-shaped multilayer wiring substrate in which a surface layer does not readily peel from a resin layer, even due to impact or a difference in the thermal expansion coefficient. A flat-plate-shaped multilayer wiring substrate in which at least two layers of a resin layer including an insulated substrate and an electroconductive pattern provided on the insulated substrate are laminated, and a surface layer, which has an elastic modulus higher than that of the insulated substrate, bonded thereon, wherein the bonding surface between the resin layers and the surface layer has concavo-convex features. A method for manufacturing a flat-plate-shaped multilayer wiring substrate including a step for overlapping, onto a resin layer, a surface layer having an elastic modulus higher than that of the resin layer, and a step for performing pressurization pressing using a flat surface from above the surface layer in a heated state and bonding the resin layer and the surface layer, the bonding surface between the resin layer and the surface layer having concavo-convex features.