Search International and National Patent Collections
|1. (WO2018100922) MULTILAYER WIRING SUBSTRATE|
|Applicants:||MURATA MANUFACTURING CO., LTD.
|Title:||MULTILAYER WIRING SUBSTRATE|
Provided is a highly reliable, flat-plate-shaped multilayer wiring substrate in which a surface layer does not readily peel from a resin layer, even due to impact or a difference in the thermal expansion coefficient. A flat-plate-shaped multilayer wiring substrate in which at least two layers of a resin layer including an insulated substrate and an electroconductive pattern provided on the insulated substrate are laminated, and a surface layer, which has an elastic modulus higher than that of the insulated substrate, bonded thereon, wherein the bonding surface between the resin layers and the surface layer has concavo-convex features. A method for manufacturing a flat-plate-shaped multilayer wiring substrate including a step for overlapping, onto a resin layer, a surface layer having an elastic modulus higher than that of the resin layer, and a step for performing pressurization pressing using a flat surface from above the surface layer in a heated state and bonding the resin layer and the surface layer, the bonding surface between the resin layer and the surface layer having concavo-convex features.