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1. (WO2018100912) HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
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Pub. No.: WO/2018/100912 International Application No.: PCT/JP2017/037794
Publication Date: 07.06.2018 International Filing Date: 19.10.2017
IPC:
H01Q 23/00 (2006.01) ,H01Q 1/24 (2006.01) ,H01Q 9/04 (2006.01) ,H04B 1/38 (2015.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
23
Aerials with active circuits or circuit elements integrated within them or attached to them
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
24
with receiving set
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38
Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
佐藤 正啓 SATO, Masahiro; JP
川村 昂 KAWAMURA, Takashi; JP
Agent:
亀谷 美明 KAMEYA, Yoshiaki; JP
金本 哲男 KANEMOTO, Tetsuo; JP
萩原 康司 HAGIWARA, Yasushi; JP
松本 一騎 MATSUMOTO, Kazunori; JP
Priority Data:
2016-23117729.11.2016JP
Title (EN) HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
(FR) MODULE HAUTE FRÉQUENCE ET DISPOSITIF DE COMMUNICATION
(JA) 高周波モジュール、および通信装置
Abstract:
(EN) [Problem] To provide: a high-frequency module provided with an omnidirectional antenna and suitable for sending and receiving radio waves in a high-frequency band; and a communication device. [Solution] This high-frequency module is provided with: an antenna part provided so as to protrude from a substrate; an antenna element at least a portion of which is provided above the antenna part; a transmission line provided on the same surface as the antenna element and provided of the same material as the antenna element; and a high-frequency element mounted on the surface of the substrate on which the transmission line is formed.
(FR) Le problème décrit par la présente invention est de fournir : un module haute fréquence comprenant une antenne omnidirectionnelle et approprié pour envoyer et recevoir des ondes radio dans une bande haute fréquence; et un dispositif de communication. La solution selon l'invention porte sur un module haute fréquence comprenant : une partie d'antenne disposée de façon à faire saillie à partir d'un substrat; un élément d'antenne dont au moins une partie est disposée au-dessus de la partie d'antenne; une ligne de transmission disposée sur la même surface que l'élément d'antenne et fournie avec le même matériau que l'élément d'antenne; et un élément haute fréquence monté sur la surface du substrat sur lequel la ligne de transmission est formée.
(JA) 【課題】無指向性のアンテナを備え、かつ高周波帯域の電波の送受信に適した高周波モジュール、および通信装置を提供する。 【解決手段】基板から突出して設けられたアンテナ部と、少なくとも一部が前記アンテナ部の上に設けられたアンテナ素子と、前記アンテナ素子と同一面に、同一材料で設けられた伝送線路と、前記基板の前記伝送線路が形成された面に実装された高周波素子と、 を備える、高周波モジュール。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)