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1. (WO2018100903) WAFER HOLDING BODY
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Pub. No.: WO/2018/100903 International Application No.: PCT/JP2017/037468
Publication Date: 07.06.2018 International Filing Date: 17.10.2017
IPC:
H01L 21/683 (2006.01) ,H01L 21/02 (2006.01) ,H05B 3/18 (2006.01) ,H05B 3/74 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
10
Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
18
the conductor being embedded in an insulating material
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
68
Heating arrangements specially adapted for cooking plates or analogous hot-plates
74
Non-metallic plates
Applicants:
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
木村 功一 KIMURA Koichi; JP
三雲 晃 MIKUMO Akira; JP
Agent:
中田 元己 NAKATA Motomi; JP
森田 剛史 MORITA Takeshi; JP
高城 政浩 TAKAGI Masahiro; JP
緒方 大介 OGATA Daisuke; JP
Priority Data:
2016-23080629.11.2016JP
Title (EN) WAFER HOLDING BODY
(FR) CORPS PORTE-PLAQUETTE
(JA) ウエハ保持体
Abstract:
(EN) This wafer holding body has: a loading stand provided with a surface for loading an object to be processed on an upper surface thereof; a supporting member that supports the loading stand from a lower surface side of the loading stand; a first cylindrical member one end of which is airtightly joined to the lower surface side of the loading stand; and a second cylindrical member disposed inside the first cylindrical member, and having one end airtightly joined to a lower surface side of the loading stand.
(FR) La présente invention concerne un corps porte-plaquette qui a : un socle de charge comportant une surface de charge d’un objet à traiter sur sa surface supérieure ; un organe de support qui supporte le socle de charge depuis un côté de surface inférieure du socle de charge ; un premier organe cylindrique dont une première extrémité est jointe de manière étanche à l’air au côté de surface inférieure du socle de charge ; et un deuxième organe cylindrique disposé à l’intérieur du premier organe cylindrique, et ayant une extrémité jointe de manière étanche à l’air à un côté de surface inférieure du socle de charge.
(JA) 被処理物の載置面を上面に備えた載置台と載置台を下面側から支持する支持部材と、一方の端部が載置台の下面側に気密に接合されている第1筒状部材と、第1筒状部材の内側に配置され、かつ、一方の端部が載置台の下面側に気密に接合されている第2筒状部材と、を有するウエハ保持体。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)