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1. (WO2018100808) COMPRESSION MOLDING DEVICE, COMPRESSION MOLDING METHOD, AND METHOD FOR PRODUCING COMPRESSION-MOLDED ARTICLE
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Pub. No.: WO/2018/100808 International Application No.: PCT/JP2017/028753
Publication Date: 07.06.2018 International Filing Date: 08.08.2017
IPC:
B29C 43/36 (2006.01) ,B29C 33/12 (2006.01) ,B29C 43/18 (2006.01) ,B29C 43/34 (2006.01) ,H01L 21/56 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43
Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
32
Component parts, details or accessories; Auxiliary operations
36
Moulds for making articles of definite length, i.e. discrete articles
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33
Moulds or cores; Details thereof or accessories therefor
12
with incorporated means for positioning inserts, e.g. labels
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43
Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
02
of articles of definite length, i.e. discrete articles
18
incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43
Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
32
Component parts, details or accessories; Auxiliary operations
34
Feeding the material to the mould or the compression means
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
Applicants:
TOWA株式会社 TOWA CORPORATION [JP/JP]; 京都府京都市南区上鳥羽上調子町5番地 5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto 6018105, JP
Inventors:
田村 孝司 TAMURA Takashi; JP
Agent:
辻丸 光一郎 TSUJIMARU Koichiro; JP
中山 ゆみ NAKAYAMA Yumi; JP
伊佐治 創 ISAJI Hajime; JP
Priority Data:
2016-23149429.11.2016JP
Title (EN) COMPRESSION MOLDING DEVICE, COMPRESSION MOLDING METHOD, AND METHOD FOR PRODUCING COMPRESSION-MOLDED ARTICLE
(FR) DISPOSITIF DE MOULAGE PAR COMPRESSION, PROCÉDÉ DE MOULAGE PAR COMPRESSION ET PROCÉDÉ DE PRODUCTION D'UN ARTICLE MOULÉ PAR COMPRESSION
(JA) 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
Abstract:
(EN) Provided is a compression molding device that makes it possible to easily suppress variation in package thickness. The compression molding device includes a mold (10) comprising: an upper mold (100) to which a substrate (1) is fixed; a lower mold comprising a mold cavity (204) to which a resin material is supplied; a positioning mechanism (207) that maintains the depth of the mold cavity (204) at a predetermined depth during mold clamping; a surplus resin accommodation section (205) for accommodating surplus resin not accommodated within the mold cavity (204) during mold clamping; and a surplus resin separating member (103). Leakage of resin from the end surface of the substrate (1) is suppressed or prevented during mold clamping of the upper mold (100) and the lower mold (200) as a result of at least part of the end surface of the substrate (1) on the surplus resin accommodation section (205) side being brought into contact with the surplus resin separating member (103). After curing of the resin within the mold cavity (204) and the surplus resin, the resin cured within the mold cavity (204) and the surplus resin cured within the surplus resin accommodation section (205) are separated as a result of the surplus resin separating member (103) raising or lowering one or both of the upper mold (100) and the lower mold (200) relative to one another.
(FR) L'invention concerne un dispositif de moulage par compression qui permet de supprimer facilement une variation de l'épaisseur du boîtier. Le dispositif de moulage par compression comprend un moule (10) comprenant : un moule supérieur (100) auquel est fixé un substrat (1) ; un moule inférieur comprenant une cavité de moule (204) à laquelle un matériau de résine est alimenté ; un mécanisme de positionnement (207) qui maintient la profondeur de la cavité de moule (204) à une profondeur prédéterminée pendant le serrage du moule ; une section de réception de la résine en surplus (205) pour recevoir la résine en surplus non logée à l'intérieur de la cavité de moule (204) pendant le serrage du moule ; et un élément de séparation de la résine en surplus (103). Une fuite de résine depuis la surface d'extrémité du substrat (1) est supprimée ou empêchée pendant le serrage du moule supérieur (100) et du moule inférieur (200) du fait qu'au moins une partie de la surface d'extrémité du substrat (1) sur la section de réception de la résine en surplus (205) est amenée en contact avec l'élément de séparation de la résine en surplus (103). Après durcissement de la résine à l'intérieur de la cavité de moule (204) et de la résine en surplus, la résine durcie à l'intérieur de la cavité de moule (204) et la résine en surplus durcie à l'intérieur de la section de réception de la résine en surplus (205) sont séparées du fait que l'élément de séparation de la résine en surplus (103) soulève ou abaisse le moule supérieur (100) et/ou le moule inférieur (200) l'un par rapport à l'autre.
(JA) 簡便にパッケージ厚みのばらつきを抑制することが可能な圧縮成形装置を提供する。 成形型(10)を含み、 成形型(10)は、 基板(1)が固定される上型(100)と、 樹脂材料が供給される型キャビティ(204)を有する下型(200)と、 型締め時における型キャビティ(204)の深さを所定深さで保持する位置決め機構(207)と、 型締め時に型キャビティ(204)内に収容されていない余剰樹脂を収容する余剰樹脂収容部(205)と、 余剰樹脂分離部材(103)と、を有し、 上型(100)と下型(200)との型締め時に、基板(1)の余剰樹脂収容部(205)側端面の少なくとも一部が、余剰樹脂分離部材(103)に接触することで、基板(1)端面からの樹脂漏れが抑制又は防止され、 型キャビティ(204)内の樹脂と前記余剰樹脂との硬化後に、余剰樹脂分離部材(103)が、上型(100)及び下型(200)の一方又は両方に対し相対的に上昇又は下降されることで、型キャビティ(204)内で硬化した樹脂と、余剰樹脂収容部(205)内で硬化した前記余剰樹脂とが分離される圧縮成形装置。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)