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|1. (WO2018100807) COMPRESSION MOLDING DEVICE, COMPRESSION MOLDING METHOD, AND METHOD FOR PRODUCING COMPRESSION-MOLDED ARTICLE|
|Title:||COMPRESSION MOLDING DEVICE, COMPRESSION MOLDING METHOD, AND METHOD FOR PRODUCING COMPRESSION-MOLDED ARTICLE|
Provided is a compression molding device that makes it possible to easily suppress variation in package thickness. In order to achieve this objective, this compression molding device includes a mold (10) comprising: an upper mold (100); a lower mold (200); a mold cavity (204) to which a resin material is supplied; a positioning mechanism (207) that maintains the depth of the mold cavity (204) at a predetermined depth during mold clamping; a surplus resin accommodation section (205) for accommodating surplus resin not accommodated within the mold cavity (204) during mold clamping; and a surplus resin separating member (103). The compression molding device is characterized in that after curing of the resin within the mold cavity (204) and the surplus resin, the resin cured within the mold cavity (204) and the surplus resin cured within the surplus resin accommodation section (205) are separated as a result of the surplus resin separating member (103) raising or lowering one or both of the upper mold (100) and the lower mold (200) relative to one another.