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1. (WO2018100730) PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Pub. No.:    WO/2018/100730    International Application No.:    PCT/JP2016/085893
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Sat Dec 03 00:59:59 CET 2016
IPC: G03F 7/004
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: KUME Masakazu
粂 壮和
MATSUMURA Ryo
松村 遼
Title: PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Abstract:
Provided is a photosensitive element 1 comprising a support film 10 and a photosensitive layer 20 disposed on the support film 10, wherein the photosensitive layer 20 contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator, and the number of defects having diameters of 2 μm or more on a principal surface 12 on the photosensitive layer 20 side of the support film 10 is 30 or fewer per 2 mm2.