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1. (WO2018100730) PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
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Pub. No.: WO/2018/100730 International Application No.: PCT/JP2016/085893
Publication Date: 07.06.2018 International Filing Date: 02.12.2016
IPC:
G03F 7/004 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD.[JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors: KUME Masakazu; JP
MATSUMURA Ryo; JP
Agent: HASEGAWA Yoshiki; JP
SHIMIZU Yoshinori; JP
HIRANO Hiroyuki; JP
Priority Data:
Title (EN) PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
(FR) ÉLÉMENT PHOTOSENSIBLE, PROCÉDÉ DE FORMATION D'UN MOTIF DE RÉSERVE ET PROCÉDÉ DE PRODUCTION DE CARTE À CÂBLAGE IMPRIMÉ
(JA) 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
Abstract: front page image
(EN) Provided is a photosensitive element 1 comprising a support film 10 and a photosensitive layer 20 disposed on the support film 10, wherein the photosensitive layer 20 contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator, and the number of defects having diameters of 2 μm or more on a principal surface 12 on the photosensitive layer 20 side of the support film 10 is 30 or fewer per 2 mm2.
(FR) L'invention concerne un élément photosensible (1) comprenant un film support (10) et une couche photosensible (20) disposée sur le film support (10), la couche photosensible (20) contenant un polymère liant, un composé photopolymérisable ayant une liaison éthyléniquement insaturée et un initiateur de photopolymérisation, et le nombre de défauts ayant des diamètres de 2 µm ou plus sur une surface principale (12) sur le côté de la couche photosensible (20) du film support (10) est de 30 ou moins pour 2 mm2
(JA) 支持フィルム10と、支持フィルム10上に配置された感光層20と、を備える感光性エレメント1であって、感光層20が、バインダーポリマーと、エチレン性不飽和結合を有する光重合性化合物と、光重合開始剤と、を含有し、支持フィルム10の感光層20側の主面12における直径2μm以上の欠陥の数が2mmあたり30個以下である、感光性エレメント1。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)