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1. (WO2018100721) PANEL PROCESSING METHOD, PANEL, AND PANEL PROCESSING DEVICE

Pub. No.:    WO/2018/100721    International Application No.:    PCT/JP2016/085784
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Fri Dec 02 00:59:59 CET 2016
IPC: B32B 3/12
B05D 3/12
C09J 5/00
F16B 5/01
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: HARADA, Katsuya
原田 一八
TSUZUKI, Eiji
都築 英嗣
SHIODA, Kazuma
塩田 一馬
NAGAKURA, Yasunori
長倉 裕規
MATSUNAGA, Keishi
松永 圭史
SAKAKIBARA, Takahiro
榊原 隆浩
Title: PANEL PROCESSING METHOD, PANEL, AND PANEL PROCESSING DEVICE
Abstract:
A base plate (111) is first placed in a bottom part of an embedding hole (103) provided in a honeycomb core (101). A filler (113) for blocking gaps between side parts of the base plate and wall surfaces of the honeycomb core is then applied to a top surface of the base plate. A push plate (112) is then pushed against the filler. As a result, the filler protrudes into the gaps, and the gaps are blocked by the filler.