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1. (WO2018100686) SLURRY, POLISHING LIQUID, METHOD FOR PRODUCING SAID SLURRY, METHOD FOR PRODUCING SAID POLISHING LIQUID, AND METHOD FOR POLISHING SUBSTRATE

Pub. No.:    WO/2018/100686    International Application No.:    PCT/JP2016/085589
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Thu Dec 01 00:59:59 CET 2016
IPC: H01L 21/304
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: TAMADA Haruhisa
玉田 春仙
ARAKAWA Keita
荒川 敬太
Title: SLURRY, POLISHING LIQUID, METHOD FOR PRODUCING SAID SLURRY, METHOD FOR PRODUCING SAID POLISHING LIQUID, AND METHOD FOR POLISHING SUBSTRATE
Abstract:
One embodiment of the present invention is a method for producing a slurry containing ceria particles and water. This method for producing a slurry comprises a pulverization step wherein ceria particles are obtained by pulverizing colloidal ceria dispersed in water. In the pulverization step, the colloidal ceria is pulverized so that the ratio of the average primary particle diameter of the ceria particles to the average primary particle diameter of the colloidal ceria is less than 0.8.