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1. (WO2018099766) METHOD FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A MATING PIECE BY LASER SOLDERING, AND CORRESPONDING ARRANGEMENT COMPRISING A SEMICONDUCTOR COMPONENT
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Pub. No.: WO/2018/099766 International Application No.: PCT/EP2017/079926
Publication Date: 07.06.2018 International Filing Date: 21.11.2017
IPC:
B23K 1/00 (2006.01) ,B23K 1/005 (2006.01) ,B23K 1/19 (2006.01) ,B23K 1/20 (2006.01) ,H01R 43/02 (2006.01) ,H05K 3/36 (2006.01) ,B23K 101/42 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
[IPC code unknown for B23K 1/05]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
19
taking account of the properties of the materials to be soldered
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
20
Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02
for soldered or welded connections
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
36
Assembling printed circuits with other printed circuits
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
101
Articles made by soldering, welding or cutting
36
Electric or electronic devices
42
Printed circuits
Applicants:
GOTTFRIED WILHELM LEIBNIZ UNIVERSITÄT HANNOVER [DE/DE]; Welfengarten 1 30167 Hannover, DE
Inventors:
WURZ, Marc, Christopher; DE
OVERMEYER, Ludger; DE
VON WITZENDORFF, Philipp; DE
HERMSDORF, Jörg; DE
BENGSCH, Sebastian; DE
Agent:
GRAMM, LINS & PARTNER PATENT- UND RECHTSANWÄLTE PARTGMBB; Freundallee 13a 30173 Hannover, DE
Priority Data:
10 2016 123 180.030.11.2016DE
Title (EN) METHOD FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A MATING PIECE BY LASER SOLDERING, AND CORRESPONDING ARRANGEMENT COMPRISING A SEMICONDUCTOR COMPONENT
(FR) PROCÉDÉ D'ASSEMBLAGE D'UN COMPOSANT SEMI-CONDUCTEUR À UNE CONTRE-PARTIE PAR SOUDAGE LASER ET DISPOSITIF POURVU D'UN COMPOSANT SEMI-CONDUCTEUR
(DE) VERFAHREN ZUM VERBINDEN EINES HALBLEITERBAUELEMENTS MIT EINEM GEGENSTÜCK DURCH LASER-LÖTEN, SOWIE ENTSPRECHENDE ANORDNUNG MIT EINEM HALBLEITERBAUELEMENT
Abstract:
(EN) The invention relates to a method of connecting a semiconductor component (1) which has connecting electric contacts on at least one side to a mating piece (3), which has mating connecting electric contacts assigned to the connecting contacts, having the following steps: arranging the semiconductor component (1) relative to the mating piece (3) in such a way that each of the connecting contacts to be connected to a mating connecting contact is oriented opposite the associated mating connecting contact, wherein at least one solder layer is respectively arranged between the connecting contacts and mating connecting contacts to be connected, irradiating a respective solder layer between associated connecting contacts and mating connecting contacts by means of a laser beam (5) through the semiconductor component (1) until the at least one solder layer melts. The invention further relates to an arrangement (1, 3) having such a semiconductor component (1) and a film substrate (3), wherein the semiconductor component (1) is fixed to the film substrate (3).
(FR) L'invention concerne un procédé d'assemblage d'un composant semi-conducteur (1), lequel comprend sur au moins un côté des contacts de connexion électriques, doté d'une contre-partie (3), laquelle comprend des contre-contacts de connexion électriques associés aux contacts de connexion électriques, ledit procédé comprenant les étapes consistant : à associer le composant semi-conducteur (1) par rapport à la contre-partie (3) de telle sorte qu'un contact de connexion à connecter avec un contre-contact de connexion respectif est aligné vers le contre-contact de connexion associé, entre les contacts de connexion à connecter et les contre-contacts de connexion au moins une couche de soudure étant respectivement disposée ; à irradier à travers une couche de soudure respective, entre les contacts de connexion associés et les contre-contacts de connexion, au moyen d'un faisceau laser (5), à l'aide du composant semi-conducteur (1), jusqu'à ce que l'au moins une couche de soudure fonde. L'invention concerne en outre un dispositif (1, 3) pourvu d'un tel composant semi-conducteur (1) et d'un substrat en feuille (3), le composant semi-conducteur (1) étant fixé au substrat en feuille (3).
(DE) Die Erfindung betrifft ein Verfahren zum Verbinden eines Halbleiterbauelements (1), das an wenigstens einer Seite elektrische Anschlusskontakte aufweist, mit einem Gegenstück (3), das den Anschlusskontakten zugeordnete elektrische Gegen-Anschlusskontakte aufweist, mit folgenden Schritten: Anordnen des Halbleiterbauteils (1) relativ zu dem Gegenstück (3) derart, dass jeder der mit einem Gegen-Anschlusskontakt zu verbindenden Anschlusskontakte gegenüber dem zugeordneten Gegen-Anschlusskontakt ausgerichtet ist, wobei zwischen zu verbindenden Anschlusskontakten und Gegen-Anschlusskontakten jeweils wenigstens eine Lotschicht angeordnet ist, Bestrahlen einer jeweiligen Lotschicht zwischen zugeordneten Anschlusskontakten und Gegen-Anschlusskontakten mittels Laserstrahl (5) durch das Halbleiterbauelement (1) hindurch, bis die wenigstens eine Lotschicht aufschmilzt. Die Erfindung betrifft außerdem eine Anordnung (1, 3) mit einem derartigen Halbleiterbauelement (1) und einem Foliensubstrat (3), wobei das Halbleiterbauelement (1)an dem Foliensubstrat (3) befestigt ist.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)