Search International and National Patent Collections

1. (WO2018099242) A LIGHT EMITTING DEVICE AND PACKAGING METHOD AND PROJECTION SYSTEM

Pub. No.:    WO/2018/099242    International Application No.:    PCT/CN2017/109331
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Sat Nov 04 00:59:59 CET 2017
IPC: H01L 33/48
Applicants: APPOTRONICS CORPORATION LIMITED
深圳市光峰光电技术有限公司
Inventors: LI, Qian
李乾
CEHN, Yusan
陈雨叁
XU, Yanzheng
许颜正
Title: A LIGHT EMITTING DEVICE AND PACKAGING METHOD AND PROJECTION SYSTEM
Abstract:
Provided are a light emitting device, a packaging method and a projection system, wherein the light emitting device comprises at least two components that are adhesively packaged together, and an interface of a bonded substrate of the components is divided into at least a first functional zone coated with a high thermal conductivity glue (103) and a second functional zone coated with a low thermal conductivity glue (104), wherein the thermal conductivity of the high thermal conductivity glue (103) is greater than the thermal conductivity of the low thermal conductivity glue (104), but the low thermal conductivity glue (104) has a higher adhesiveness than the high thermal conductivity glue (103). The light emitting device meets the requirement of high thermal conductivity bonding while ensuring high-strength adhesive performance, thereby achieving high reliability of the light emitting device.