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1. (WO2018098923) STYRYL SILOXY PHENOLIC RESIN, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF

Pub. No.:    WO/2018/098923    International Application No.:    PCT/CN2017/076526
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Wed Mar 15 00:59:59 CET 2017
IPC: C08G 8/30
C08L 61/14
C08L 83/05
C08L 9/06
H05K 1/03
Applicants: SHENGYI TECHNOLOGY CO., LTD.
广东生益科技股份有限公司
Inventors: YUAN, Chane
袁婵娥
LUO, Hongyun
罗鸿运
FAN, Huayong
范华勇
LIN, Wei
林伟
Title: STYRYL SILOXY PHENOLIC RESIN, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Abstract:
The present invention provides a styryl siloxy phenolic resin, a preparation method therefor and an application thereof. The styryl siloxy phenolic resin has a structure as shown in formula I. The present invention introduces unsaturated C=C double bond and siloxy group into the side chain of the phenolic resin by using a simple synthesis method, so that the resin combines low dielectric property of curing of the double bond and heat resistance, weather resistance, flame retardancy, dielectric property, and low water absorption of the siloxy group at the same time, thereby making better use of the application advantages of phenolic resins in copper clad laminates and providing excellent dielectric property, moist-heat resistance, and heat resistance required by a high-frequency and high-speed copper clad laminate.