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|1. (WO2018098923) STYRYL SILOXY PHENOLIC RESIN, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF|
|Applicants:||SHENGYI TECHNOLOGY CO., LTD.
|Title:||STYRYL SILOXY PHENOLIC RESIN, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF|
The present invention provides a styryl siloxy phenolic resin, a preparation method therefor and an application thereof. The styryl siloxy phenolic resin has a structure as shown in formula I. The present invention introduces unsaturated C=C double bond and siloxy group into the side chain of the phenolic resin by using a simple synthesis method, so that the resin combines low dielectric property of curing of the double bond and heat resistance, weather resistance, flame retardancy, dielectric property, and low water absorption of the siloxy group at the same time, thereby making better use of the application advantages of phenolic resins in copper clad laminates and providing excellent dielectric property, moist-heat resistance, and heat resistance required by a high-frequency and high-speed copper clad laminate.