Search International and National Patent Collections

1. (WO2018098586) APPARATUS AND METHOD FOR INJECTION MOLDING ENCAPSULATION

Pub. No.:    WO/2018/098586    International Application No.:    PCT/CA2017/051447
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Sat Dec 02 00:59:59 CET 2017
IPC: B29C 45/14
Applicants: MI INTÉGRATION S.E.N.C.
Inventors: NADEAU, Nicolas
THERRIEN, Jean
MARTIN, Yves
Title: APPARATUS AND METHOD FOR INJECTION MOLDING ENCAPSULATION
Abstract:
An injection mold for encapsulating a substrate comprises a lower mold component and an upper mold component adapted to form an encapsulation mold at an edge of the substrate when the upper mold component engages the lower mold component. The lower mold component comprises a substrate support and wherein the upper mold component comprises a recess. The injection mold includes a tiltable insert sized and shaped to slide within the recess to form a seal for the encapsulation mold, the insert having a substrate-contacting surface defining an area of the substrate contacted by the insert. The injection mold includes a plurality of pressure-exerting actuators connected to the tiltable insert and each being configured to independently apply pressure on the substrate via the insert, wherein the plurality of pressure-exerting actuators are adapted to equilibrate a total predetermined pressure exerted by the insert substantially evenly across the area of the substrate-contacting surface.