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1. (WO2018089853) INTEGRATED MICROSTRIP AND SUBSTRATE INTEGRATED WAVEGUIDE CIRCULATORS/ISOLATORS FORMED WITH CO-FIRED MAGNETIC-DIELECTRIC COMPOSITES
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Pub. No.: WO/2018/089853 International Application No.: PCT/US2017/061184
Publication Date: 17.05.2018 International Filing Date: 10.11.2017
IPC:
H01P 1/36 (2006.01) ,H01P 1/38 (2006.01) ,H01P 3/08 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1
Auxiliary devices
32
Non-reciprocal transmission devices
36
Isolators
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1
Auxiliary devices
32
Non-reciprocal transmission devices
38
Circulators
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3
Waveguides; Transmission lines of the waveguide type
02
with two longitudinal conductors
08
Microstrips; Strip lines
Applicants:
SKYWORKS SOLUTIONS, INC. [US/US]; 20 Sylvan Road Woburn, MA 01801, US
Inventors:
CRUICKSHANK, David Bowie; US
FIROR, David Martin; US
MACFARLANE, Iain Alexander; IE
Agent:
JUANG, Agnes; US
Priority Data:
62/421,78614.11.2016US
62/506,95816.05.2017US
Title (EN) INTEGRATED MICROSTRIP AND SUBSTRATE INTEGRATED WAVEGUIDE CIRCULATORS/ISOLATORS FORMED WITH CO-FIRED MAGNETIC-DIELECTRIC COMPOSITES
(FR) CIRCULATEURS/ISOLATEURS DE GUIDE D'ONDES INTÉGRÉS À MICRORUBAN ET SUBSTRAT INTÉGRÉS CONSTITUÉS DE COMPOSITES MAGNÉTIQUES-DIÉLECTRIQUES CO-CUITS
Abstract:
(EN) Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8GHz or above 3GHz, which allows devices to be used in the 5G space.
(FR) L'invention concerne des modes de réalisation de circulateurs/isolateurs de guide d'ondes intégrés à microruban et substrat qui peuvent être intégrés à un substrat. Cette structure composite peut servir de plate-forme pour d'autres composants, permettant une miniaturisation améliorée des composants. Des modes de réalisation de l'invention peuvent être particulièrement avantageux dans les plages de hautes fréquences, telles que celles supérieures à 1,8 GHz ou supérieures à 3 GHz, ce qui permet d'utiliser des dispositifs dans l'espace 5G.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)