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|1. (WO2018088754) INSULATING LAYER MANUFACTURING METHOD AND MULTI-LAYERED PRINTED CIRCUIT BOARD MANUFACTURING METHOD|
|Applicants:||LG CHEM, LTD.
|Inventors:||JEONG, Woo Jae
KYUNG, You Jin
CHOI, Byung Ju
CHOI, Bo Yun
LEE, Kwang Joo
JEONG, Min Su
|Title:||INSULATING LAYER MANUFACTURING METHOD AND MULTI-LAYERED PRINTED CIRCUIT BOARD MANUFACTURING METHOD|
The present invention relates to an insulating layer manufacturing method, which enables manufacturing by a faster and simpler method so as to improve process efficiency, readily adjust the thickness of an insulating layer, and form a via hole of a high resolution without physical damage, and a multi-layered printed circuit board manufacturing method using the insulating layer acquired from the insulating layer manufacturing method.