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1. (WO2018088754) INSULATING LAYER MANUFACTURING METHOD AND MULTI-LAYERED PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Pub. No.:    WO/2018/088754    International Application No.:    PCT/KR2017/012343
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Fri Nov 03 00:59:59 CET 2017
IPC: H05K 3/46
H05K 3/00
H05K 3/02
H05K 3/42
Applicants: LG CHEM, LTD.
주식회사 엘지화학
Inventors: JEONG, Woo Jae
정우재
KYUNG, You Jin
경유진
CHOI, Byung Ju
최병주
CHOI, Bo Yun
최보윤
LEE, Kwang Joo
이광주
JEONG, Min Su
정민수
Title: INSULATING LAYER MANUFACTURING METHOD AND MULTI-LAYERED PRINTED CIRCUIT BOARD MANUFACTURING METHOD
Abstract:
The present invention relates to an insulating layer manufacturing method, which enables manufacturing by a faster and simpler method so as to improve process efficiency, readily adjust the thickness of an insulating layer, and form a via hole of a high resolution without physical damage, and a multi-layered printed circuit board manufacturing method using the insulating layer acquired from the insulating layer manufacturing method.