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1. (WO2018088720) NOTCH POLISHING PAD DRESSING DEVICE AND METHOD FOR MANUFACTURING WAFER USING SAME DEVICE

Pub. No.:    WO/2018/088720    International Application No.:    PCT/KR2017/011751
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Wed Oct 25 01:59:59 CEST 2017
IPC: H01L 21/02
H01L 21/304
H01L 21/306
H01L 21/67
H01L 23/00
Applicants: SK SILTRON CO., LTD.
에스케이실트론 주식회사
Inventors: LEE, Yong Dae
이용대
KIM, Soo Jin
김수진
Title: NOTCH POLISHING PAD DRESSING DEVICE AND METHOD FOR MANUFACTURING WAFER USING SAME DEVICE
Abstract:
A notch polishing pad dressing device for dressing a notch polishing pad for polishing a notch portion of a wafer according to an embodiment comprises: a body; a bonding layer arranged on the body and containing a metallic material; a coating layer coated on the surface of the bonding layer; and a cutting material, which is fixedly attached to the body by the bonding layer, protrudes from the upper face of the coating layer, and is attached to a notch polishing pad to dress the notch polishing pad.