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1. (WO2018088718) COIL SUBSTRATE

Pub. No.:    WO/2018/088718    International Application No.:    PCT/KR2017/011698
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Sat Oct 21 01:59:59 CEST 2017
IPC: H01F 17/00
H01F 5/00
H05B 6/36
Applicants: LG ELECTRONICS INC.
엘지전자 주식회사
Inventors: KIM, Hyungjun
김형준
HWANGBO, Kyungsoo
황보경수
Title: COIL SUBSTRATE
Abstract:
According to the present invention, a coil substrate can comprise a first conductor layer and a second conductor layer periodically arranged on an upper part and a lower part of a substrate, and overlapping each other. Each of the first and second conductor layers can comprise a plurality of first and second segments. The coil substrate can further comprise: first connection lines for connecting the first and second segments of the first conductor layer; and second connection lines for connecting the first and second segments of the second conductor layer. Each of the first connection lines can comprise: a first region exposed and disposed on first and/or second surfaces, which are opposite to each other, of the substrate; and second and third regions disposed while penetrating the substrate from both sides of the first region.