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1. (WO2018088671) LED PACKAGE

Pub. No.:    WO/2018/088671    International Application No.:    PCT/KR2017/007628
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Tue Jul 18 01:59:59 CEST 2017
IPC: H01L 25/075
H01L 33/48
H01L 33/36
H01L 33/50
H01L 33/62
H01L 33/64
H01L 25/16
Applicants: ALLIX CO.,LTD.
Inventors: PARK, Nohjoon
AN, Jonguk
An LED package having a plurality of light emitting regions includes a plurality of LED chips. The LED package further includes a plurality of electrode portions on which each of the plurality of LED chips is mounted, and a package mold portion having a plurality of openings formed on one surface thereof so as to each emit light by the plurality of LED chips.