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1. (WO2018088493) PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

Pub. No.:    WO/2018/088493    International Application No.:    PCT/JP2017/040472
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Fri Nov 10 00:59:59 CET 2017
IPC: H05K 1/03
C08J 5/24
H01L 23/12
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: SAITOH, Takeshi
斉藤 猛
NAKAMURA, Yukio
中村 幸雄
SASAKI, Ryohta
佐々木 亮太
SOMEKAWA, Junki
染川 淳生
TOSAKA, Yuji
登坂 祐治
SHIMIZU, Hiroshi
清水 浩
UCHIMURA, Ryoichi
内村 亮一
Title: PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
Abstract:
Provided are: a printed wiring board which is effectively suppressed in warping even through circuit patterns having different metal contents are formed on both surfaces of a cured product sheet of a prepreg; and a semiconductor package which is obtained by mounting a semiconductor element on this printed wiring board. Specifically, this printed wiring board comprises a cured product of a prepreg that contains a fiber substrate and a resin composition, while having circuit patterns which have different metal contents formed on both surfaces of the cured product sheet of the prepreg. This printed wiring board is configured such that: the prepreg has layers, which are formed from resin compositions having different thermal curing shrinkage ratios, on front and back surfaces of the fiber substrate, respectively; and a layer that is formed from a resin composition having a lower thermal curing shrinkage ratio among the above-described layers is present on a surface on which a circuit pattern having a smaller metal content is formed.