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|1. (WO2018088493) PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE|
|Applicants:||HITACHI CHEMICAL COMPANY, LTD.
|Title:||PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE|
Provided are: a printed wiring board which is effectively suppressed in warping even through circuit patterns having different metal contents are formed on both surfaces of a cured product sheet of a prepreg; and a semiconductor package which is obtained by mounting a semiconductor element on this printed wiring board. Specifically, this printed wiring board comprises a cured product of a prepreg that contains a fiber substrate and a resin composition, while having circuit patterns which have different metal contents formed on both surfaces of the cured product sheet of the prepreg. This printed wiring board is configured such that: the prepreg has layers, which are formed from resin compositions having different thermal curing shrinkage ratios, on front and back surfaces of the fiber substrate, respectively; and a layer that is formed from a resin composition having a lower thermal curing shrinkage ratio among the above-described layers is present on a surface on which a circuit pattern having a smaller metal content is formed.