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|1. (WO2018088416) THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF, AND MANUFACTURING METHOD|
|Applicants:||SHIN-ETSU CHEMICAL CO., LTD.
|Title:||THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF, AND MANUFACTURING METHOD|
A highly thermally conductive silicone composition including: (A) an organopolysiloxane; (B) a spherical aluminum oxide powder with an average sphericity of 0.8 or greater, 30 hydroxyl groups/nm2 or less, and an average particle diameter of 50 to 150μm; and (C) a spherical or amorphous aluminum oxide powder with an average particle diameter of 0.1 to 5μm, wherein the mixing ratio by volume of the (B) component and the (C) component is 5:5 to 9.5:0.5, the total quantity of the (B) component and the (C) component within the composition is 80 to 90vol%, the thermal conductivity of the composition according to a hot disk method conforming to ISO 22007-2 is 5.5W/m∙K or greater, and the viscosity of the composition at 25°C is 30 to 800Pa∙s when measured with a spiral viscometer at a rotational speed of 10rpm.