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1. (WO2018088416) THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF, AND MANUFACTURING METHOD

Pub. No.:    WO/2018/088416    International Application No.:    PCT/JP2017/040202
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Thu Nov 09 00:59:59 CET 2017
IPC: C08L 83/04
C08K 3/22
C08K 3/40
C08K 5/541
Applicants: SHIN-ETSU CHEMICAL CO., LTD.
信越化学工業株式会社
Inventors: IWATA Mitsuhiro
岩田 充弘
YAMADA Kunihiro
山田 邦弘
HOSODA Narimi
細田 也実
Title: THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF, AND MANUFACTURING METHOD
Abstract:
A highly thermally conductive silicone composition including: (A) an organopolysiloxane; (B) a spherical aluminum oxide powder with an average sphericity of 0.8 or greater, 30 hydroxyl groups/nm2 or less, and an average particle diameter of 50 to 150μm; and (C) a spherical or amorphous aluminum oxide powder with an average particle diameter of 0.1 to 5μm, wherein the mixing ratio by volume of the (B) component and the (C) component is 5:5 to 9.5:0.5, the total quantity of the (B) component and the (C) component within the composition is 80 to 90vol%, the thermal conductivity of the composition according to a hot disk method conforming to ISO 22007-2 is 5.5W/m∙K or greater, and the viscosity of the composition at 25°C is 30 to 800Pa∙s when measured with a spiral viscometer at a rotational speed of 10rpm.