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|1. (WO2018088370) POLISHING COMPOSITION AND SILICON WAFER POLISHING METHOD|
|Title:||POLISHING COMPOSITION AND SILICON WAFER POLISHING METHOD|
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. These abrasive particles have a shear viscosity of at least 1.3 mPa·s at a shear rate of 1,000/s in a liquid for measuring shear viscosity having a pH of 11.3 and containing abrasive particles at a concentration of 17% by mass and tetramethyl ammonium hydroxide.