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1. (WO2018088370) POLISHING COMPOSITION AND SILICON WAFER POLISHING METHOD

Pub. No.:    WO/2018/088370    International Application No.:    PCT/JP2017/039982
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Tue Nov 07 00:59:59 CET 2017
IPC: C09K 3/14
B24B 37/00
C09G 1/02
H01L 21/304
Applicants: FUJIMI INCORPORATED
株式会社フジミインコーポレーテッド
Inventors: AKIZUKI Reiko
秋月 麗子
TSUCHIYA Kohsuke
土屋 公亮
TANIGUCHI Megumi
谷口 恵
Title: POLISHING COMPOSITION AND SILICON WAFER POLISHING METHOD
Abstract:
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. These abrasive particles have a shear viscosity of at least 1.3 mPa·s at a shear rate of 1,000/s in a liquid for measuring shear viscosity having a pH of 11.3 and containing abrasive particles at a concentration of 17% by mass and tetramethyl ammonium hydroxide.