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Pub. No.:    WO/2018/088335    International Application No.:    PCT/JP2017/039798
Publication Date: 17.05.2018 International Filing Date: 02.11.2017
H01L 21/52 (2006.01), B22F 1/00 (2006.01), B22F 7/04 (2006.01), H01B 1/22 (2006.01), H01L 23/48 (2006.01)
Applicants: DENSO CORPORATION [JP/JP]; 1-1, Showa-cho, Kariya-city, Aichi 4488661 (JP)
Inventors: SUGIURA Kazuhiko; (JP).
IWASHIGE Tomohito; (JP).
Agent: YOU-I PATENT FIRM; Nagoya Nishiki City Bldg. 4F 1-6-5, Nishiki, Naka-ku, Nagoya-shi, Aichi 4600003 (JP)
Priority Data:
2016-219745 10.11.2016 JP
(JA) 半導体装置
Abstract: front page image
(EN)This semiconductor device is configured to comprise: a mounting member (2) which has electrodes (21, 22); conductive members (1, 3) which are arranged so as to face the electrodes (21, 22); and bonding members (5, 6) which are arranged between the mounting member (2) and the conductive members (1, 3), and which electrically and mechanically connect the electrodes (21, 22) and the conductive members (1, 3) to each other. The bonding members (5, 6) are configured from a sintered body in which auxiliary particles (9) containing metal atoms that have a higher aggregation energy than Ag atoms are added to Ag particles (8).
(FR)La présente invention concerne un dispositif à semi-conducteurs conçu pour comprendre : un élément de montage (2) qui possède des électrodes (21, 22) ; des éléments conducteurs (1, 3) qui sont agencés de façon à faire face aux électrodes (21, 22) ; et des éléments de liaison (5, 6) qui sont disposés entre l'élément de montage (2) et les éléments conducteurs (1, 3), et qui connectent électriquement et mécaniquement les électrodes (21, 22) et les éléments conducteurs (1, 3) les uns aux autres. Les éléments de liaison (5, 6) sont conçus à partir d'un corps fritté dans lequel des particules auxiliaires (9) contenant des atomes métalliques qui ont une énergie d'agrégation plus élevée que des atomes d'argent sont ajoutées à des particules d'argent (8).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)