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1. (WO2018088094) BONDING DEVICE, BONDING SYSTEM, BONDING METHOD, AND COMPUTER STORAGE MEDIUM
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Pub. No.: WO/2018/088094 International Application No.: PCT/JP2017/036782
Publication Date: 17.05.2018 International Filing Date: 11.10.2017
IPC:
H01L 21/02 (2006.01) ,B23K 20/00 (2006.01) ,H01L 21/68 (2006.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 東京都港区赤坂五丁目3番1号 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325, JP
Inventors:
中満 孝志 NAKAMITSU, Takashi; JP
松本 宗兵 MATSUMOTO, Shuhei; JP
大森 陽介 OMORI, Yosuke; JP
Agent:
金本 哲男 KANEMOTO, Tetsuo; JP
亀谷 美明 KAMEYA, Yoshiaki; JP
萩原 康司 HAGIWARA, Yasushi; JP
Priority Data:
2016-21858009.11.2016JP
Title (EN) BONDING DEVICE, BONDING SYSTEM, BONDING METHOD, AND COMPUTER STORAGE MEDIUM
(FR) DISPOSITIF DE LIAISON, SYSTÈME DE LIAISON, PROCÉDÉ DE LIAISON, ET SUPPORT D'ENREGISTREMENT POUR ORDINATEUR
(JA) 接合装置、接合システム、接合方法及びコンピュータ記憶媒体
Abstract:
(EN) This bonding device that bonds substrates to one another comprises: a first holding part which, on the bottom surface thereof, applies a vacuum to a first substrate, thereby holding the substrate by means of the vacuum; a second holding part which is provided beneath the first holding part, and which, on the upper surface thereof, applies a vacuum to a second substrate, thereby holding the substrate by means of the vacuum; a movement part which moves the first holding part and the second holding part relative to one another in the horizontal direction; a laser interferometer which measures the positions of the first holding part and the second holding part which are moved by the movement unit; a linear scale that measures the position of the movement unit; and a control unit which control the movement unit using the measurement results of the laser interferometer and the linear scale.
(FR) La présente invention concerne un dispositif de liaison qui lie des substrats l'un à l'autre comprenant : une première partie de maintien qui, sur sa surface inférieure, applique un vide à un premier substrat, maintenant ainsi le substrat au moyen du vide ; une seconde partie de maintien qui est disposée en-dessous de la première partie de maintien, et qui, sur sa surface supérieure, applique un vide à un second substrat, maintenant ainsi le substrat au moyen du vide ; une partie de déplacement qui déplace la première partie de maintien et la seconde partie de maintien l'une par rapport à l'autre dans la direction horizontale ; un interféromètre laser qui mesure les positions de la première partie de maintien et de la seconde partie de maintien qui sont déplacées par l'unité de mouvement ; une échelle linéaire qui mesure la position de l'unité de déplacement ; et une unité de commande qui commande l'unité de déplacement à l'aide des résultats de mesure de l'interféromètre laser et de l'échelle linéaire.
(JA) 基板同士を接合する接合装置は、下面に第1の基板を真空引きして吸着保持する第1の保持部と、当該第1の保持部の下方に設けられ、上面に第2の基板を真空引きして吸着保持する第2の保持部と、第1の保持部と第2の保持部を相対的に水平方向に移動させる移動部と、当該移動部によって移動する第1の保持部又は第2の保持部の位置を測定するレーザ干渉計と、当該移動部の位置を測定するリニアスケールと、レーザ干渉計の測定結果と当該リニアスケールの測定結果を用いて、移動部を制御する制御部と、を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)