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|1. (WO2018087990) DIAMINE COMPOUND, HEAT-RESISTANT RESIN USING SAME, AND RESIN COMPOSITION|
|Applicants:||TORAY INDUSTRIES, INC.
|Title:||DIAMINE COMPOUND, HEAT-RESISTANT RESIN USING SAME, AND RESIN COMPOSITION|
The present invention relates to: a novel diamine compound; a heat-resistant resin which uses this diamine compound; and a resin composition which uses this heat-resistant resin. Consequently, the present invention enables the achievement of a cured film that has excellent chemical resistance and film characteristics even in cases where a heat treatment is carried out at such a low temperature as 200°C or less. The novel diamine is represented by general formula (1). A heat-resistant resin or a resin composition according to the present invention is suitable for use in a surface protective film or an interlayer insulating film of a semiconductor device and an insulating layer or a planarization layer of an organic electroluminescent (organic EL) element.