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1. (WO2018087990) DIAMINE COMPOUND, HEAT-RESISTANT RESIN USING SAME, AND RESIN COMPOSITION

Pub. No.:    WO/2018/087990    International Application No.:    PCT/JP2017/030746
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Tue Aug 29 01:59:59 CEST 2017
IPC: C07C 237/04
C07C 235/24
C08G 69/26
C08G 73/08
C08G 73/10
H01L 21/336
H01L 23/12
H01L 23/29
H01L 23/31
H01L 27/32
H01L 29/786
H01L 51/50
H05B 33/02
H05B 33/12
H05B 33/22
Applicants: TORAY INDUSTRIES, INC.
東レ株式会社
Inventors: MASUDA, Yuki
増田有希
OKUDA, Ryoji
奥田良治
Title: DIAMINE COMPOUND, HEAT-RESISTANT RESIN USING SAME, AND RESIN COMPOSITION
Abstract:
The present invention relates to: a novel diamine compound; a heat-resistant resin which uses this diamine compound; and a resin composition which uses this heat-resistant resin. Consequently, the present invention enables the achievement of a cured film that has excellent chemical resistance and film characteristics even in cases where a heat treatment is carried out at such a low temperature as 200°C or less. The novel diamine is represented by general formula (1). A heat-resistant resin or a resin composition according to the present invention is suitable for use in a surface protective film or an interlayer insulating film of a semiconductor device and an insulating layer or a planarization layer of an organic electroluminescent (organic EL) element.