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1. (WO2018087985) RESIN-METAL BONDED BODY AND PRESSURE SENSOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/087985 International Application No.: PCT/JP2017/030413
Publication Date: 17.05.2018 International Filing Date: 24.08.2017
IPC:
G01L 19/14 (2006.01) ,B29C 65/00 (2006.01) ,H01L 29/84 (2006.01)
Applicants: DENSO CORPORATION[JP/JP]; 1-1, Showa-cho, Kariya-city, Aichi 4488661, JP
OSAKA UNIVERSITY[JP/JP]; 1-1, Yamadaoka, Suita-shi, Osaka 5650871, JP
Inventors: MORI Hodaka; JP
YAMAKAWA Hiroyuki; JP
IMAI Hirokazu; JP
YOSHIDA Norihito; JP
IZUMI Ryosuke; JP
ISHIKAWA Motomi; JP
MATUBAYASI Nobuyuki; JP
Agent: YOU-I PATENT FIRM; Nagoya Nishiki City Bldg. 4F 1-6-5, Nishiki, Naka-ku, Nagoya-shi, Aichi 4600003, JP
Priority Data:
2016-22067411.11.2016JP
Title (EN) RESIN-METAL BONDED BODY AND PRESSURE SENSOR
(FR) CORPS LIÉ EN RÉSINE-MÉTAL ET CAPTEUR DE PRESSION
(JA) 樹脂金属接合体及び圧力センサ
Abstract: front page image
(EN) This resin-metal bonded body (100) is provided with a metallic surface (103) having, formed thereon, nano recesses (104) having an opening width L in the submicron or nano order of magnitude and a synthetic resin member (101) that is formed from a synthetic resin material having a radius of gyration Rg satisfying the condition 2Rg/L ≤ 1/2. The synthetic resin member is bonded to the metallic surface.
(FR) Ce corps lié en résine-métal (100) est pourvu d'une surface métallique (103) ayant, formés sur celle-ci, des nano-évidements (104) ayant une largeur d'ouverture L de l'ordre de grandeur submicronique ou nanométrique et un élément en résine synthétique (101) qui est formé à partir d'un matériau de résine synthétique ayant un rayon de giration Rg satisfaisant la condition 2Rg/L ≤ 1/2. L'élément en résine synthétique est lié à la surface métallique.
(JA) 樹脂金属接合体(100)は、サブミクロンオーダー又はナノオーダーの開口幅Lを有するナノ凹部(104)が形成された金属表面(103)と、慣性半径Rgが2Rg/L≦1/2を満たす合成樹脂材料によって形成された合成樹脂部材(101)とを備える。合成樹脂部材は、金属表面に接合されている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)