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1. (WO2018087890) SEMICONDUCTOR DEVICE, INVERTER UNIT, AND AUTOMOBILE

Pub. No.:    WO/2018/087890    International Application No.:    PCT/JP2016/083541
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Sat Nov 12 00:59:59 CET 2016
IPC: H01L 23/48
H01L 23/28
H01L 23/50
H01L 25/07
H01L 25/18
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: NAKATA, Yosuke
中田 洋輔
IMOTO, Yuji
井本 裕児
SASAKI, Taishi
佐々木 太志
KAWASE, Tatsuya
川瀬 達也
Title: SEMICONDUCTOR DEVICE, INVERTER UNIT, AND AUTOMOBILE
Abstract:
A semiconductor chip (2a) is bonded to the upper surface of a conductor substrate (1a). A control terminal (11a) is disposed further toward the outside than the semiconductor chip (2a), and is connected, using a conductive wire (12a), to a control electrode of the semiconductor chip (2a). A case (10) surrounds the semiconductor chip (2a). A sealing material (13) seals the semiconductor chip (2a). A lead frame (4) has: a bonding portion (4a) bonded to the semiconductor chip (2a); and a perpendicular portion (4b), which is incorporated into the case (10), and which is led out from the bonding portion (4a) to the outside of the control terminal (11a), said perpendicular portion rising in the direction perpendicular to the upper surface of the semiconductor chip (2a).