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|1. (WO2018087872) IMAGING MODULE AND ENDOSCOPE|
|Title:||IMAGING MODULE AND ENDOSCOPE|
An imaging unit 1 is provided with: an imaging unit 20 in which a plurality of semiconductor elements 22-25 including an imaging element 22 are laminated; and a frame member 10 in which the imaging unit 20 is inserted through a hollow part H10, wherein the imaging unit 20 has a first side surface 20S1 orthogonal to the principal surface of the imaging element and a second side surface 20S2 opposed to the first side surface 20S1, and wherein two edges 20L1 and 20L2 orthogonal to the principal surface of the imaging element among the four edges of the first side surface 20S1 of the imaging unit 20 abut against the inner surface of the frame member 10, while the second side surface 20S2 does not abut against the inner surface of the frame member 10.