WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |

Search International and National Patent Collections
World Intellectual Property Organization
Machine translation
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/087807    International Application No.:    PCT/JP2016/083068
Publication Date: 17.05.2018 International Filing Date: 08.11.2016
H01L 21/283 (2006.01)
Applicants: MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310 (JP)
Inventors: NAKANO, Seiya; (JP)
Agent: TAKADA, Mamoru; (JP).
Priority Data:
(JA) 半導体装置
Abstract: front page image
(EN)The invention comprises: a surface metal formed on a base board; a first protective film formed on the surface metal; a second protective film transparent to light, and having a first section disposed on the first protective film, and a second section connected to the first section and disposed on the surface metal; and a metal film having a main body section disposed on the surface metal, and an overlapping section connected to the main body section and overlapping the first protective film. The main body section is thicker than the first protective film, the first section is thicker than the stacking-over section, and the second section is thicker than the main body section.
(FR)L'invention comprend : une surface métallique formée sur une plaque de base; un premier film protecteur formé sur la surface métallique; un second film protecteur transparent à la lumière, et ayant une première section disposée sur le premier film protecteur, et une seconde section reliée à la première section et disposée sur la surface métallique; et un film métallique ayant une section de corps principal disposée sur la surface métallique, et une section de chevauchement reliée à la section de corps principal et chevauchant le premier film de protection. La section de corps principal est plus épaisse que le premier film de protection, la première section est plus épaisse que la section d'empilement, et la seconde section est plus épaisse que la section de corps principal.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)