Search International and National Patent Collections

1. (WO2018087619) WIRE SAW

Pub. No.:    WO/2018/087619    International Application No.:    PCT/IB2017/056655
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Fri Oct 27 01:59:59 CEST 2017
IPC: B28D 5/04
B28D 5/00
Inventors: POVEGLIANO, Roberto
The invention relates to a wire saw (10) for cutting a piece of material, particularly for slicing, squaring and/or bricking a piece of semiconductor material, comprising - a first compartment (1) in which wire guide rollers (3, 4) for supporting a cutting field (5) formed from a cutting wire (6) are arranged, characterized in, that the wire saw (10) comprises - at least one second compartment (2) for accommodating a portion of the cutting wire (6), - an opening (7) connecting the first compartment (1) with the second compartment (2), - screening means (11, 12, 13, 14) for preventing ingress of cutting liquid, dirt and/or material particles through the opening (7) into the second compartment (2), - at least one cutting wire feedthrough (8) for guiding the cutting wire (6) from the first compartment (1) through the screening means (11, 12, 13, 14) towards the second compartment (2), wherein preferably the cutting wire feedthrough (8) extends through the opening (7).