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1. (WO2018087052) SOLDER MASK INKJET INKS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

Pub. No.:    WO/2018/087052    International Application No.:    PCT/EP2017/078381
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Wed Nov 08 00:59:59 CET 2017
IPC: C09D 11/101
C09D 11/30
C09D 11/322
C09D 11/38
Applicants: AGFA-GEVAERT N.V.
ELECTRA POLYMER LTD.
Inventors: LOCCUFIER, Johan
GOETHALS, Fabienne
VAN AERT, Hubertus
TORFS, Rita
SAUVAGEOT, Marion
Title: SOLDER MASK INKJET INKS FOR MANUFACTURING PRINTED CIRCUIT BOARDS
Abstract:
The invention provides an inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board. By using a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter, a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties, may be produced.