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1. (WO2018086909) LEAD FRAME, OPTOELECTRONIC COMPONENT HAVING A LEAD FRAME, AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

Pub. No.:    WO/2018/086909    International Application No.:    PCT/EP2017/077491
Publication Date: Fri May 18 01:59:59 CEST 2018 International Filing Date: Fri Oct 27 01:59:59 CEST 2017
IPC: H01L 33/62
H01L 33/48
H01L 33/56
H01L 33/64
Applicants: OSRAM OPTO SEMICONDUCTORS GMBH
Inventors: LAMFALUSI, Tamas
RICHTER, Markus
Title: LEAD FRAME, OPTOELECTRONIC COMPONENT HAVING A LEAD FRAME, AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT
Abstract:
The invention relates to a lead frame (1) for a radiation-emitting semiconductor chip (7), comprising a first element (2) which has a first main extension plane, a second element (3) which has a second extension plane, and a third element (4) which has a third main extension plane, wherein - the first main extension plane, the second main extension plane, and the third main extension plane are arranged parallel to each other, - the three elements (2, 3, 4) are arranged one above the other in a stacking direction (R), and - the third element (4) has a support face (9) for the semiconductor chip (7), said surface being smaller than a mounting surface (8) of the semiconductor chip (7). The invention also relates to an optoelectronic component and to a method for producing an optoelectronic component.