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1. (WO2018085715) METHOD AND APPARATUS FOR ENCAPSULATION OF AN ORGANIC LIGHT EMITTING DIODE
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Pub. No.: WO/2018/085715 International Application No.: PCT/US2017/060037
Publication Date: 11.05.2018 International Filing Date: 03.11.2017
IPC:
H01L 51/52 (2006.01) ,H01L 51/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants:
ORBOTECH LT SOLAR, LLC. [US/US]; 5970 Optical Court San Jose, California 95138, US
Inventors:
LAW, Kam S.; US
STEVENS, Craig L.; US
TOSHIMA, Masato; US
Agent:
BACH, Joseph; US
Priority Data:
62/418,17506.11.2016US
Title (EN) METHOD AND APPARATUS FOR ENCAPSULATION OF AN ORGANIC LIGHT EMITTING DIODE
(FR) PROCÉDÉ ET APPAREIL D'ENCAPSULATION D'UNE DIODE ÉLECTROLUMINESCENTE ORGANIQUE
Abstract:
(EN) A substrate includes a plurality of OLED, each having a conductor layer. A coating is formed over the OLEDs, the coating comprises a first inorganic layer formed over the OLED structures and at least partially over each of the contact layers, a buffer layer over the first inorganic layer, a second inorganic layer over the buffer layer, wherein the buffer layer comprises a first inorganic interface layer in contact with the first inorganic layer, a second inorganic interface layer in contact with the second inorganic layer, and an organic layer sandwiched between the first and second inorganic interface layers.
(FR) Un substrat comprend une pluralité d'OLED, chacune ayant une couche conductrice. Un revêtement est formé sur les OLED, le revêtement comprend une première couche inorganique formée sur les structures OLED et au moins partiellement sur chacune des couches de contact, une couche tampon sur la première couche inorganique, une seconde couche inorganique sur la couche tampon, la couche tampon comprenant une première couche d'interface inorganique en contact avec la première couche inorganique, une seconde couche d'interface inorganique en contact avec la seconde couche inorganique, et une couche organique prise en sandwich entre les première et seconde couches d'interface inorganique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)