Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018085667) METHOD AND APPARATUS FOR FLEXIBLE CIRCUIT CABLE ATTACHMENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/085667 International Application No.: PCT/US2017/059948
Publication Date: 11.05.2018 International Filing Date: 03.11.2017
IPC:
H05K 3/34 (2006.01) ,H05K 1/11 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
Applicants:
JABIL INC. [US/US]; 10560 Dr. Martin Luther King Jr. Street, N. St. Petersburg, Florida 33716, US
Inventors:
WANG, Wenlu; US
TUDMAN, Mark A.; US
SANTOS, Michael Piring; US
BENZ, Ross Kristensen; US
LY, Hien; US
FANG, Gary; US
Agent:
HUQ, Abhik A.; US
Priority Data:
15/344,10104.11.2016US
Title (EN) METHOD AND APPARATUS FOR FLEXIBLE CIRCUIT CABLE ATTACHMENT
(FR) PROCÉDÉ ET APPAREIL DE FIXATION DE CÂBLE DE CIRCUIT SOUPLE
Abstract:
(EN) A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
(FR) L'invention concerne un procédé et un appareil pour une fixation de câble de circuit souple multiple. Des bosses en or sont liées sur des pastilles d'interconnexion d'un substrat pour créer une structure en colonne et une soudure ou un époxy conducteur est distribué sur le circuit de câble souple. Le substrat et le circuit de câble souple sont alignés et pressés ensemble à l'aide d'une force ou du placement d'un poids sur le substrat ou le circuit de câble souple. Une chaleur appropriée est appliquée pour refondre la soudure ou durcir l'époxy. La soudure mouille sur les pastilles de substrat, aidée par les bosses en or, et a un risque de pontage réduit dû à la structure en colonne. Un époxy de remplissage non conducteur est appliqué pour augmenter la résistance mécanique.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)