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1. (WO2018085117) USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS

Pub. No.:    WO/2018/085117    International Application No.:    PCT/US2017/058577
Publication Date: Sat May 12 01:59:59 CEST 2018 International Filing Date: Fri Oct 27 01:59:59 CEST 2017
IPC: C23C 16/40
C23C 16/34
C23C 16/32
C23C 16/30
C23C 16/50
C23C 16/56
C23C 16/448
H01L 21/02
Applicants: VERSUM MATERIALS US, LLC
Inventors: VRTIS, Raymond, Nicholas
RIDGEWAY, Robert, Gordon
ACHTYL, Jennifer Lynn, Anne
ENTLEY, William, Robert
SINATORE, Dino
THEODOROU, Kathleen, Esther
ADAMCZYK, Andrew, J.
Title: USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS
Abstract:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same.