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1. (WO2018084637) OXIDATION-RESISTANT HYBRID STRUCTURE COMPRISING METAL THIN FILM LAYER COATED ON EXTERIOR OF CONDUCTIVE POLYMER STRUCTURE, AND PREPARATION METHOD THEREFOR
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Pub. No.: WO/2018/084637 International Application No.: PCT/KR2017/012411
Publication Date: 11.05.2018 International Filing Date: 03.11.2017
IPC:
C23C 18/16 (2006.01) ,C23C 18/31 (2006.01) ,C23C 18/20 (2006.01) ,C23C 18/28 (2006.01) ,C23C 18/30 (2006.01) ,C23C 18/40 (2006.01) ,C23C 18/34 (2006.01) ,C23C 18/52 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
20
of organic surfaces, e.g. resins
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
20
of organic surfaces, e.g. resins
28
Sensitising or activating
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
20
of organic surfaces, e.g. resins
28
Sensitising or activating
30
Activating
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
38
Coating with copper
40
using reducing agents
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
32
Coating with one of iron, cobalt or nickel; Coating with mixtures of phosphorus or boron with one of these metals
34
using reducing agents
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
52
using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32-C23C18/50152
Applicants:
아주대학교산학협력단 AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION [KR/KR]; 경기도 수원시 영통구 월드컵로 206 (원천동) (Woncheon-dong), 206, World cup-ro, Yeongtong-gu, Suwon-si Gyeonggi-do 16499, KR
주식회사 엘파니 ELPANI CO., LTD. [KR/KR]; 경기도 화성시 비봉면 양노남길 74-13 74-13, Yangnonam-gil, Bibong-myeon, Hwaseong-si Gyeonggi-do 18284, KR
Inventors:
이석현 LEE, Suck Hyun; KR
권오필 KWON, O Pil; KR
정명조 JUNG, Myung Jo; KR
김태자 KIM, Tae Ja; KR
Agent:
특허법인 엠에이피에스 MAPS INTELLECTUAL PROPERTY LAW FIRM; 서울시 강남구 테헤란로8길 37, 8층 (역삼동, 한동빌딩) (Yeoksam-dong, Handong Bldg.), 8F, 37, Teheran-ro 8-gil, Gangnam-gu Seoul 06239, KR
Priority Data:
10-2016-014703704.11.2016KR
Title (EN) OXIDATION-RESISTANT HYBRID STRUCTURE COMPRISING METAL THIN FILM LAYER COATED ON EXTERIOR OF CONDUCTIVE POLYMER STRUCTURE, AND PREPARATION METHOD THEREFOR
(FR) STRUCTURE HYBRIDE RÉSISTANT À L'OXYDATION COMPRENANT UNE COUCHE DE FILM MINCE MÉTALLIQUE APPLIQUÉE SUR L'EXTÉRIEUR D'UNE STRUCTURE POLYMÈRE CONDUCTRICE, ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(KO) 전도성 고분자 구조체 외부에 코팅된 금속 박막 층을 포함하는 내산화성 하이브리드 구조체 및 이의 제조 방법
Abstract:
(EN) The present application: relates to a hybrid structure for improving oxidation resistance and corrosion resistance, comprising a metal layer (thin film layer) coated on the exterior of a conductive polymer structure; and comprises a preparation method reducing a metal salt precursor by using a solution containing a conductive polymer structure, a metal salt precursor, a reducing agent, and a dispersion solvent, so as to coat a metal on the surface of a conductive polymer structure through an electroless plating method, thereby obtaining a hybrid structure comprising a metal thin film layer coated on the surface of the conductive polymer structure.
(FR) La présente invention concerne une structure hybride destinée à améliorer la résistance à l'oxydation et la résistance à la corrosion, comprenant une couche métallique (couche de film mince) appliquée sur l'extérieur d'une structure polymère conductrice ; et elle comprend un procédé de préparation consistant à réduire un précurseur de sel métallique à l'aide d'une solution contenant une structure polymère conductrice, un précurseur de sel métallique, un agent réducteur et un solvant de dispersion, de manière à déposer un métal sur la surface d'une structure polymère conductrice par un procédé de dépôt autocatalytique, ce qui permet d'obtenir une structure hybride comprenant une couche de film mince métallique appliquée sur la surface de la structure polymère conductrice.
(KO) 본원은, 전도성 고분자 구조체 외부에 코팅된 금속 층 (박막 층)을 포함하는 내산화성 및 내부식성을 향상시키기 위한 하이브리드 구조체에 관한 것으로, 전도성 고분자 구조체, 금속 염 전구체, 환원제 및 분산 용매를 함유하는 용액을 이용하여 금속 염 전구체를 환원시킴으로써 무전해 도금법에 의하여 전도성 고분자 구조체의 표면에 금속을 코팅시키는 것에 의해 전도성 고분자 구조체 표면에 코팅된 금속 박막 층을 포함하는 하이브리드 구조체를 수득하는 제조방법을 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)