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1. (WO2018084496) CONDUCTIVE ADHESIVE FILM ATTACHING DEVICE

Pub. No.:    WO/2018/084496    International Application No.:    PCT/KR2017/011981
Publication Date: Sat May 12 01:59:59 CEST 2018 International Filing Date: Sat Oct 28 01:59:59 CEST 2017
IPC: G02F 1/1345
G02F 1/13
Applicants: AP SYSTEMS INC.
에이피시스템 주식회사
Inventors: TO, Hyun Gu
도현구
LEE, Dong Ju
이동주
HWANG, Huck
황혁
Title: CONDUCTIVE ADHESIVE FILM ATTACHING DEVICE
Abstract:
Disclosed is a conductive adhesive film attaching device comprising: a target substrate; a support part for supporting the target substrate from below and fixing the target substrate; a supply part having a supply roller and disposed spaced apart from one side of an upper portion of the support part; a collection part having a collection roller and disposed, spaced apart from the supply part, on the other side of the upper portion of the support part; a conductive adhesive film in which a conductive adhesive film portion is disposed facing the target substrate and a protection film portion is attached to the reverse side of the facing portion, one side of the conductive adhesive film being connected to the supply roller and the other side being connected to the collection roller such that the conductive adhesive film moves a set travel distance from the supply part to the collection part; a cutting part positioned in the space between the supply part and the support part, and connected to a rotating body that performs a preset rotation in one direction and the reverse direction, the cutting part being rotatably connected to the rotation body so that at least the center of the cutting part is not connected to the rotation body, and thereby moving up-and-down in a straight line to avoid cutting at least the protection film portion; and a pressing part disposed above the conductive adhesive film, for pressing the conductive adhesive film toward the target substrate by moving in a straight line.