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1. (WO2018084121) CURABLE INSULATING COMPOSITION FOR PRINTED WIRING BOARDS, DRY FILM, CURED PRODUCT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING CURABLE INSULATING COMPOSITION FOR PRINTED WIRING BOARDS
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Pub. No.: WO/2018/084121 International Application No.: PCT/JP2017/039190
Publication Date: 11.05.2018 International Filing Date: 30.10.2017
IPC:
H05K 1/03 (2006.01) ,C08L 101/00 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/032 (2006.01) ,H05K 3/28 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
太陽ホールディングス株式会社 TAIYO HOLDINGS CO., LTD. [JP/JP]; 埼玉県比企郡嵐山町大字大蔵388番地 388, Oaza Okura, Ranzan-machi, Hiki-gun, Saitama 3550222, JP
株式会社東北テクノアーチ TOHOKU TECHNO ARCH CO., LTD. [JP/JP]; 宮城県仙台市青葉区荒巻字青葉468番地 468, Aza Aoba, Aramaki, Aoba-ku, Sendai-shi, Miyagi 9800845, JP
Inventors:
宇敷 滋 USHIKI Shigeru; JP
三輪 崇夫 MIWA Takao; JP
有田 稔彦 ARITA Toshihiko; JP
Agent:
本多 一郎 HONDA Ichiro; JP
Priority Data:
2016-21470601.11.2016JP
Title (EN) CURABLE INSULATING COMPOSITION FOR PRINTED WIRING BOARDS, DRY FILM, CURED PRODUCT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING CURABLE INSULATING COMPOSITION FOR PRINTED WIRING BOARDS
(FR) COMPOSITION ISOLANTE DURCISSABLE POUR CARTES DE CIRCUIT IMPRIMÉ, FILM SEC, PRODUIT DURCI, CARTE DE CIRCUIT IMPRIMÉ, ET PROCÉDÉ DE PRODUCTION DE COMPOSITION ISOLANTE DURCISSABLE POUR CARTES DE CIRCUIT IMPRIMÉ
(JA) プリント配線板用の硬化性絶縁性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板用の硬化性絶縁性組成物の製造方法
Abstract:
(EN) Provided are: a curable insulating composition for printed wiring boards, which exhibits excellent dispersibility of an inorganic filler and is not susceptible to aggregation of the inorganic filler; a dry film which has a resin layer obtained from this composition; a cured product which is obtained by curing this composition or the resin layer of this dry film; a printed wiring board which comprises this cured product; and a method for producing this composition. A curable insulating composition for printed wiring boards, which contains a surface-treated inorganic filler and a curable resin, and which is characterized in that the surface-treated inorganic filler is obtained by subjecting an inorganic filler to an organic surface treatment by means of living radical polymerization; and the like. It is preferable that the surface-treated inorganic filler is obtained by subjecting an inorganic filler to a hydrophilic organic surface treatment by means of living radical polymerization and subsequently subjecting the inorganic filler to a hydrophobic organic surface treatment by means of living radical polymerization.
(FR) La présente invention concerne : une composition isolante durcissable pour cartes de circuit imprimé, qui présente une excellente dispersibilité d'une charge inorganique et n'est pas sensible à l'agrégation de la charge inorganique; un film sec doté d'une couche de résine obtenue à partir de cette composition; un produit durci obtenu par durcissement de cette composition ou de la couche de résine de ce film sec; une carte de circuit imprimé comprenant ce produit durci; et un procédé de production de cette composition. L'invention concerne une composition isolante durcissable pour cartes de circuit imprimé, contenant une charge inorganique traitée en surface et une résine durcissable, et caractérisé en ce que la charge inorganique traitée en surface est obtenue en soumettant une charge inorganique à un traitement de surface organique au moyen d'une polymérisation radicalaire vivante; et analogues. Il est préférable que la charge inorganique traitée en surface soit obtenue en soumettant une charge inorganique à un traitement de surface organique hydrophile au moyen d'une polymérisation radicalaire vivante, puis en soumettant la charge inorganique à un traitement de surface organique hydrophobe au moyen d'une polymérisation radicalaire vivante.
(JA) 無機フィラーの分散性に優れ、かつ、無機フィラーの凝集が起こりにくいプリント配線板用の硬化性絶縁性組成物、該組成物から得られる樹脂層を有するドライフィルム、該組成物または該ドライフィルムの樹脂層を硬化させて得られる硬化物、該硬化物を有するプリント配線板、該組成物の製造方法を提供する。表面処理無機フィラーと硬化性樹脂を含有する組成物であって、前記表面処理無機フィラーが無機フィラー上にリビングラジカル重合で有機表面処理したものであることを特徴とするプリント配線板用の硬化性絶縁性組成物等である。前記表面処理無機フィラーは、無機フィラー上にリビングラジカル重合で親水性の有機表面処理した後、リビングラジカル重合で疎水性の有機表面処理したものであることが好ましい。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)