WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2018084072) FLUX, SOLDER COMPOSITION AND METHOD FOR PRODUCING BONDED BODY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/084072    International Application No.:    PCT/JP2017/038769
Publication Date: 11.05.2018 International Filing Date: 26.10.2017
IPC:
B23K 35/363 (2006.01), B23K 1/19 (2006.01), B23K 35/26 (2006.01), B23K 101/36 (2006.01), B23K 103/12 (2006.01), C22C 9/00 (2006.01), C22C 13/00 (2006.01)
Applicants: KOKI COMPANY LIMITED [JP/JP]; 32-1, Senju Asahi-cho, Adachi-ku, Tokyo 1200026 (JP)
Inventors: UCHIDA Noriyoshi; (JP).
SATO Yusuke; (JP)
Agent: IZAWA Makiko; (JP)
Priority Data:
2016-217103 07.11.2016 JP
Title (EN) FLUX, SOLDER COMPOSITION AND METHOD FOR PRODUCING BONDED BODY
(FR) FLUX, COMPOSITION DE BRASURE ET PROCÉDÉ DE PRODUCTION DE CORPS LIÉ
(JA) フラックス、はんだ組成物及び接合体の製造方法
Abstract: front page image
(EN)A flux which contains at least one component selected from the group consisting of diglycolic acid and salts thereof; and the like.
(FR)La présente invention concerne un flux qui contient au moins un constituant choisi dans le groupe constitué par l'acide diglycolique et ses sels ; et analogues.
(JA)ジグリコール酸及びその塩からなる群から選択される少なくとも一種である成分を含むフラックス等である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)